Doi.org/10.1149/2.0071704jes

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Target ArticleEdit

Low Thermal Expansion Coefficient Electrodeposited Copper and Its Contraction Mechanism by Annealing  ; Dinh Van Quy Kazuo Kondo; NULL; 04/01/2017; https://doi.org/10.1149/2.0071704jes

ReasonsEdit

Note: Reasons not yet here included, but you are welcome to insert this information whenever you wish.