Doi.org/10.1149/2.0071704jes
Target ArticleEdit
Low Thermal Expansion Coefficient Electrodeposited Copper and Its Contraction Mechanism by Annealing ; Dinh Van Quy Kazuo Kondo; NULL; 04/01/2017; https://doi.org/10.1149/2.0071704jes
ReasonsEdit
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